Electronic device

ABSTRACT

An electronic device is provided. The electronic device includes a first substrate, a polarizer, and a conductive adhesive. The polarizer is disposed on the first substrate and has a conductive layer. The conductive adhesive is disposed on the first substrate and electrically connected to the conductive layer. From a top view, the conductive adhesive is adjacent to an edge of the polarizer and has an extending direction. An angle between the extending direction and an absorption-axis direction of the polarizer is between 80° and 100°.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority of China Patent Application No.202210555630.X, filed on May 19, 2022, the entirety of which isincorporated by reference herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present disclosure relates to an electronic device, and, inparticular, to an electronic device provided with a conductive adhesive.

Description of the Related Art

With the vigorous development of panel display technology and thereduction of manufacturing costs, panel display devices with advantagessuch as low radiation, small thickness, and low power consumption aremore and more favored by consumers. Therefore, the panel display devicesare widely used in electronic devices, such as mobile phones, gameconsoles, PDAs, etc. In general, panel display devices mainly includeplasma display panels (PDPs), liquid crystal displays (LCDs), andorganic light-emitting diode (OLED) displays, etc., wherein the liquidcrystal display devices have gradually become the mainstream paneldisplay devices in the market due to its relatively low cost.

During the evolution of electronic devices, in order to meet the demandsof high resolution and achieve higher production capacity, the size ofdisplay devices has continued to scale down, causing many unresolvedproblems in the manufacturing process of electronic devices. Whileexisting electronic devices generally meet the needs of the user, theyare not entirely satisfactory in every respect. Therefore, it is stillnecessary to improve the structure of electronic devices in order tomanufacture a display device that meets product requirements and has anenhanced visual effect.

BRIEF SUMMARY OF THE INVENTION

An electronic device is provided according to some embodiments of thepresent disclosure. The electronic device includes a first substrate, apolarizer, and a conductive adhesive. The polarizer is disposed on thefirst substrate and has a conductive layer. The conductive adhesive isdisposed on the first substrate and electrically connected to theconductive layer. From a top view, the conductive adhesive is adjacentto an edge of the polarizer and has an extending direction. An anglebetween the extending direction and an absorption-axis direction of thepolarizer is between 80 degrees and 100 degrees.

In order to make the features or advantages of the present disclosuremore comprehensible, some embodiments are illustrated hereinafter, anddetailed descriptions are provided with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a top view of an electronic device according to someembodiments of the present disclosure.

FIG. 1B is a cross-sectional view of an electronic device according tosome embodiments of the present disclosure.

FIG. 1C is a partial enlarged view of the electronic device in FIG. 1Baccording to some embodiments of the present disclosure.

FIG. 2 is a top view of an electronic device according to otherembodiments of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter is a detailed description of the electronic device of theembodiments of the present disclosure. It should be understood that thefollowing description provides many different embodiments forimplementing various aspects of some embodiments of the presentdisclosure. The specific elements and arrangements described below aremerely to clearly describe some embodiments of the present disclosure.Of course, these are only used as examples rather than limitations ofthe present disclosure. Furthermore, similar and/or correspondingreference numerals may be used in different embodiments to designatesimilar and/or corresponding elements, in order to clearly describe thepresent disclosure. However, the use of these similar and/orcorresponding reference numerals is only for the purpose of simply andclearly description of some embodiments of the present disclosure, anddoes not imply any correlation between the different embodiments and/orstructures discussed.

It should be understood that the drawings of the present disclosure arenot drawn to scale, and in fact, the dimensions of elements may bearbitrarily enlarged or reduced in order to clearly represent thefeatures of the present disclosure.

In addition, when referring to “a layer is on or over another layer”, itmay refer to the case where the layer is in direct contact with anotherlayer. Alternatively, it may also be the case that the layer is not indirect contact with another layer. In this case, one or moreintermediate layers are disposed between the layer and another layer.

It should be understood that ordinal numbers such as “first”, “second”,and the like used in the specification and claims are used to modifyelements and are not intended to imply and represent the element(s) haveany previous ordinal numbers, and do not represent the order of acertain element and another element, or the order of the manufacturingmethod. The use of these ordinal numbers is only used to clearlydistinguish an element with a certain name and another element with thesame name. The claims and the specification may not use the same terms,for example, a first element in the specification may be a secondelement in the claims.

The term “about” used herein generally means within 10%, within 5%,within 3%, within 2%, within 1%, or within 0.5% of a given value or agiven range. The value given herein is an approximate value, that is,the meaning of “about” may still be implied without the specificdescription of “about”. Furthermore, the phrase “a range is greater thanor equal to a first value, and the range is less than or equal to asecond value” means that the range includes the first value, the secondvalue, and other values in between.

Unless otherwise defined, all terms including technical and scientificterms used herein have the same meaning as commonly understood by aperson of ordinary skills in the art. It should be understood that theseterms, such as those defined in commonly used dictionaries, should beinterpreted as having meanings consistent with the relevant art and thebackground or context of the present disclosure, and should not beinterpreted in an idealized or overly formal manner, unless otherwisedefined in the embodiments of the present disclosure.

According to some embodiments of the present disclosure, an opticalmicroscope (OM), a scanning electron microscope (SEM), a film thicknessprofilometer (α-step), an ellipsometer, or other suitable methods may beused to measure the spacing or distance between elements, or the width,thickness, height, or area of each element. In detail, according to someembodiments, a scanning electron microscope may be used to obtain across-sectional structure image including the element to be measured,and measure the pitch or distance between each element, or the width,thickness, height, or area of each element.

It should be understood that in the following embodiments withoutdeparting from the spirit of the present disclosure, features in severaldifferent embodiments may be replaced, combined, and recombined tobecome other embodiments. As long as the features of the embodiments donot violate the spirit or conflict with each other, they may bearbitrarily recombined and used.

According to some embodiments of the present disclosure, an electronicdevice is provided. The electronic device includes a polarizer andconductive adhesive disposed on a first substrate. The conductiveadhesive is adjacent to an edge of the polarizer, and an angle betweenthe extending direction and an absorption-axis direction of thepolarizer is between 80° and 100°. In this way, the possibility of theconductive adhesive being penetrated into the polarizer in a humid andwarm environment may be reduced, thereby affecting the visual effect ofthe peripheral area of the electronic device.

It should be understood that, in addition to display devices, theembodiments of the present disclosure may be applied to variouselectronic devices, such as light emitting devices, touch devices,sensing devices, antenna devices, splicing devices, or combinationsthereof, but the present disclosure is not limited thereto. Theelectronic device may be a bendable or flexible electronic device. Theelectronic device may include, for example, light-emitting diodes,liquid crystals, fluorescence, phosphors, other suitable display media,or combinations thereof, but the present disclosure is not limitedthereto. The light emitting diode may include, for example, organiclight-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs),mini-light-emitting diodes (mini-LEDs), micro-light-emitting diodes(micro-LEDs), quantum dots (QDs) light-emitting diodes (such as QLEDs,QDLEDs), other suitable materials, or any permutation and combinationthereof, but the present disclosure is not limited thereto. The displaydevice may include, for example, a spliced display device, but thepresent disclosure is not limited thereto. The concepts or principles ofthe present disclosure may also be applied to non-self-illuminatingliquid crystal displays (LCDs), but the present disclosure is notlimited thereto.

The antenna device may be, for example, a liquid crystal type antennadevice or a non-liquid crystal type antenna device, but the presentdisclosure is not limited thereto. The antenna device may include, forexample, a splicing antenna device, but the present disclosure is notlimited thereto. The sensing device may be a sensing device for sensingcapacitance, light, heat, or ultrasonic, but the present disclosure isnot limited thereto. It should be noted that the electronic device maybe any permutation and combination thereof, but the present disclosureis not limited thereto. In addition, the shape of the electronic devicemay be rectangular, circular, polygonal, with curved edges, or othersuitable shapes. The electronic device may have peripheral systems suchas a driving system, a control system, and a light source system tosupport a display device, an antenna device, or a splicing device. Theelectronic device of the present disclosure may be, for example, adisplay device, but the present disclosure is not limited thereto.

FIGS. 1A and 1B are respectively a top view and a cross-sectional viewof an electronic device 10 according to some embodiments of the presentdisclosure. It should be noted that the cross-sectional view of FIG. 1Bis taken along the section line AA′ in FIG. 1A. Referring to FIGS. 1Aand 1B, the electronic device 10 includes a first substrate 100, apolarizer 104, and a conductive adhesive 106. The polarizer 104 and theconductive adhesive 106 are disposed on the first substrate 100. Asshown in FIG. 1B, the polarizer 104 has a conductive layer 1042, and theconductive adhesive 106 is electrically connected to the conductivelayer 1042 of the polarizer 104. In some embodiments, the conductivelayer 1042 of the polarizer 104 may be used as an antistatic layer,which may reduce the impact of excessive static charges accumulated onthe surface of the electronic device 10 on the touch effect of theelectronic device 10. The conductive adhesive 106 electrically connectedto the conductive layer 1042 may provide a static conduction path forthe electronic device 10, so as to transfer the static electricityaccumulated on the surface of the electronic device 10 to otherconductive structures on the first substrate 100, thereby improving thedisplay quality and touch effect of the electronic device 10.

In some embodiments, although not explicitly shown in FIGS. 1A and 1Band subsequent drawings, the first substrate 100 may include, forexample, a base substrate, a thin film transistor layer (TFT layer)disposed on the base substrate and used as a driving circuit, anelectrode layer disposed on the base substrate and electricallyconnected to the thin film transistor layer, and/or an alignment layerdisposed on the thin film transistor layer and the electrode layer. Thealignment layer may be used to align the liquid crystal molecules in theliquid crystal layer to have a desired orientation.

In some embodiments, the conductive layer 1042 of the polarizer 104 mayinclude, for example, pressure sensitive adhesive (PSA), but the presentdisclosure is not limited thereto. In some embodiments, the material ofthe conductive layer 1042 may contain carboxyl groups, hydroxyl groups,esters, or combinations thereof, but the present disclosure is notlimited thereto. According to some embodiments, a surface resistance ofthe conductive layer 1042 may be between about 10⁸Ω/□ (i.e. Ω/square,Ω/sq, or Ω/m²) and about 10¹⁰Ω/□, such as about 2.5×10⁸Ω/□, about5×10⁸Ω/□, 7.5×10⁸Ω/□, or about 1.5×10⁹Ω/□. In some embodiments, thethickness 1042T of the conductive layer 1042 in a normal direction ofthe first substrate 100 (e.g., the Z-axis in FIG. 1B) may be between 1μm and 30 μm, for example, about 10 μm. The conductive layer 1042 whoseresistance and thickness are within the above range may maintain goodtouch sensitivity and achieve desired antistatic effect. In someembodiments, the material of the conductive adhesive 106 may includecopper, silver, or alloys thereof, but the present disclosure is notlimited thereto.

As shown in FIG. 1A, the conductive adhesive 106 is adjacent to an edgeof the polarizer 104 and extends laterally along a horizontal direction(e.g., the X-axis in FIG. 1A). Furthermore, an angle between theextending direction of the conductive adhesive 106 and anabsorption-axis direction of the polarizer 104 is between 80 degrees and100 degrees, such as about 90 degrees. During the fabrication of thepolarizer 104, sub-layers in the polarizer 104 are stretched to have theabsorption-axis extending along a specific direction. However, when thesub-layers of the polarizer 104 are stretched, the sub-layers shrinkalong a direction perpendicular to the stretching direction, resultingin misalignment between the sub-layers of the polarizer 104. If theconductive adhesive 106 is formed along the edge occurring shrinks ofthe sub-layers of the polarizer 104, the conductive adhesive 106 may bepenetrated into the polarizer 104 in a humid and warm environment.Therefore, when the conductive adhesive 106 is designed to have theangle between the extension direction and the absorption-axis directionof the polarizer 104 within the above range, the probability of theconductive adhesive 106 being penetrated into the polarizer 104 may bereduced, thereby maintaining the visual effect of the periphery area ofthe electronic device 10. Furthermore, the above design is alsoconducive to the development of the electronic device 10 towardextremely narrow borders.

According to some embodiments, an absorption-axis direction of apolarizer to be tested may be determined by using a polarizer with aknown absorption-axis direction. In detail, firstly, the polarizer withthe known absorption-axis direction is overlapped with the polarizer tobe tested. Next, the polarizer is rotated with the known absorption-axisdirection until light cannot pass through the two polarizers. When thelight cannot pass through the two overlapping polarizers, theabsorption-axis directions of the two polarizers are perpendicular toeach other, so the absorption-axis direction of the polarizer to betested may be obtained. In other embodiments, the absorption-axisdirection may be measured by a spectrometer (such as a spectrometer ofthe type JASCO V-7100). This apparatus may inject an incident light intoa linear polarizer to form a linear polarized light. This linearpolarized light enters the sample to be tested, and the opticalproperties (absorption-axis angle, polarization degree, transmittance,etc.) of the sample to be tested may be obtained by rotating withdifferent angles, but the present disclosure is not limited thereto.

According to some embodiments, as shown in FIG. 1B, the polarizer 104may further include a polarizing film 1044. In some embodiments, theconductive adhesive 106 may be in contact with the edge of the polarizer104. In an embodiment, the conductive adhesive 106 is at least incontact with the conductive layer 1042 of the polarizer 104. In anembodiment, the conductive adhesive 106 may be in contact with both theconductive layer 1042 and the polarizing film 1044 of the polarizer 104.Although not explicitly shown in FIG. 1B and subsequent drawings, itshould be understood that according to different embodiments, thepolarizing film 1044 of the polarizer 104 may be a single-layerstructure or a multi-layer structure including multi-sub-polarizingfilms. The sub-polarizing film in the multi-layer structure may be afunctional film layer that provides at least one of the functions suchas anti-reflection, anti-glare, anti-fouling, and enhancement of lighttransmittance.

According to some embodiments, as shown in FIGS. 1A and 1B, theinterface where the conductive adhesive 106 is in contact with thepolarizer 104 is the contact region 106CR, and a portion of the contactregion 106CR is the region where the conductive adhesive 106 is incontact with the conductive layer 1042. In some embodiments, in the topview shown in FIG. 1A, the length 106L of the region where theconductive adhesive 106 is in contact with the conductive layer 1042along the extending direction of the conductive adhesive 106 (e.g., theX-axis in FIG. 1A) may be greater than about 10% of the width 104W ofthe polarizer 104 along the extension direction of the conductiveadhesive 106 (e.g., the X-axis in FIG. 1A), such as greater than about20%, about 30%, about 40%, about 50%, about 60%, about 70%, about 80%,or about 90%. If the length 106L is too short, such as less than about10% of the width 104W, the conductive adhesive 106 may not effectivelyconduct the static electricity accumulated on the surface of theelectronic device 10. Furthermore, in some embodiments, the length 106Lof the region where the conductive adhesive 106 is in contact with theconductive layer 1042 along the extending direction of the conductiveadhesive 106 (e.g., the X-axis in FIG. 1A) may be equal to the width104W of the polarizer 104 along the extension direction of conductiveadhesive 106 (e.g., the X-axis in FIG. 1A).

According to some embodiments, as shown in FIG. 1B, the contact region106CR may have a width 106W along the normal direction of the firstsubstrate 100 (e.g., the Z-axis in FIG. 1B). That is, the width 106W isthe height of the contact interface between the conductive adhesive 106and the polarizer 104. In some embodiments, the width 106W may begreater than or equal to the thickness 1042T of the conductive layer1042 of the polarizer 104 in the normal direction of the first substrate100 (e.g., the Z-axis in FIG. 1B). In some embodiments, the width 106Wmay be between about 1 μm and about 250 μm.

In some embodiments, the electronic device 10 may further include asecond substrate 102. The second substrate 102 is disposed between thefirst substrate 100 and the polarizer 104. As shown in FIG. 1B, theconductive adhesive 106 may be further disposed on the second substrate102. According to some embodiments, the second substrate 102 may includea base substrate, and the base substrate may include a color filter anda light shielding layer. In an embodiment, the second substrate 102 mayfurther include an alignment layer. In an embodiment in which the secondsubstrate 102 includes an alignment layer, the alignment layer may bedisposed on a side of the base substrate not disposed with the polarizer104. In some other embodiments, the second substrate may not include thecolor filter and the light-shielding layer, but the present disclosureis not limited thereto. The base substrates of the first substrate 100and the second substrate 102 of the present disclosure may be, forexample, flexible or inflexible substrates, and the materials mayinclude plastic, glass, quartz, sapphire, ceramics, carbon fiber, othersuitable substrate materials, or combinations thereof, but the presentdisclosure is not limited thereto. In some embodiments, the aboveplastic materials may include polyimide (PI), polyethylene terephthalate(PET), polycarbonate (PC), and other suitable materials, or combinationsthereof, but the present disclosure is not limited thereto. In someother embodiments, the second substrate 102 may be replaced by anencapsulation layer. The encapsulation layer may provide protection,encapsulation, and/or planarization functions for the display units, andthe encapsulation layer may include organic materials, inorganicmaterials, combinations thereof, or mixtures thereof, but the presentdisclosure is not limited thereto.

In some embodiments, the polarizer 104 may be in contact with the secondsubstrate 102. In an embodiment, the polarizer 104 may be in contactwith the second substrate 102 directly. More specifically, in anembodiment, the conductive layer 1042 of the polarizer 104 may be incontact with the second substrate 102. According to some embodiments, asshown in FIG. 1B, the conductive adhesive 106 may have a thickness 106T2from an upper surface 102US of the second substrate 102 to a topmostsurface 106TS of the conductive adhesive 106. In some embodiments, thethickness 106T2 may be smaller than the thickness 104T of the polarizer104 in the normal direction of the first substrate 100 (e.g., the Z-axisin FIG. 1B). The thickness 106T2 of the conductive adhesive 106 issmaller than the thickness 104T of the polarizer 104. That is, the levelof the topmost surface 106TS of the conductive adhesive 106 is lowerthan the upper surface of the polarizer 104, which may reduce the riskof light leakage and reduce the possibility of damage during theassembly process of the electronic device 10.

In some embodiments, the thickness 106T2 of the conductive adhesive 106may be between about 1 μm and about 250 μm. In some embodiments, thethickness 104T of the polarizer 104 may be between about 50 μm and about250 μm.

Still referring to FIGS. 1A and 1B, in some embodiments, the electronicdevice 10 may further include a conductive pad 108. The conductive pad108 may be disposed on the first substrate 100. In detail, in anembodiment, the conductive pad 108 may be disposed on a portion of thefirst substrate 100 that does not overlap with the second substrate 102.In some embodiments, in addition to disposing the conductive pad 108,the portion of the first substrate 100 that does not overlap with thesecond substrate 102 may be used as a region electrically connected to aflexible printed circuit board, a region electrically connected to adriving integrated circuit chip, or a region bonded with a drivingintegrated circuit chip, but the present disclosure is not limitedthereto.

According to some embodiments, the conductive pad 108 may beelectrically connected to the conductive adhesive 106 to further providea path for the static electricity transmitted through the conductiveadhesive 106 to discharge. In some embodiments, as shown in FIG. 1B, theconductive adhesive 106 may be formed on the conductive pad 108 andextend from the conductive pad 108 to the first substrate 100 and thesecond substrate 102. According to some embodiments, the material of theconductive pad 108 may include aluminum (Al), copper (Cu), molybdenum(Mo), titanium (Ti), platinum (Pt), iridium (Jr), nickel (Ni), chromium(Cr), silver (Ag), gold (Au), tungsten (W), or alloys thereof, but thepresent disclosure is not limited thereto.

Still referring to FIG. 1B, in some embodiments, the electronic device10 may further include a liquid crystal layer 103. The liquid crystallayer 103 is sandwiched between the first substrate 100 and the secondsubstrate 102. In some embodiments, as shown in FIGS. 1A and 1B, theprojection planes of the liquid crystal layer 103 and the secondsubstrate 102 on the first substrate 100 may overlap each other.Therefore, in the top view of FIG. 1A, the second substrate 102 maycover the liquid crystal layer 103.

Still referring to FIG. 1B, in some embodiments, an additional polarizer110 may be disposed on the side of the first substrate 100 not disposedwith the liquid crystal layer 103. Likewise, the polarizer 110 may havea similar or the same composition to polarizer 104. According to someembodiments, the polarizer 110 may be a single-layer structure or amulti-layer structure including multi-sub-polarizing films. Thesub-polarizing film in the multi-layer structure may be a functionalfilm layer that provides at least one of the functions, such asanti-reflection, anti-glare, anti-fouling, and enhancement of lighttransmittance.

Next, referring to FIG. 1C, FIG. 1C is a partial enlarged view of theelectronic device 10 shown in FIG. 1B according to some embodiments ofthe present disclosure. It should be noted that FIG. 1C is taken fromthe region R in FIG. 1B. According to some embodiments, the polarizingfilm 1044 of the polarizer 104 may include sub-polarizing films 1044A,1044B and 1044C. Although the polarizing film 1044 is only shown ashaving three layers of sub-polarizing films (the sub-polarizing films1044A, 1044B, and 1044C) in FIG. 1C, the present disclosure is notlimited thereto. In other embodiments, the polarizing film 1044 mayinclude less layers or more layers of sub-polarizing films.

As described above, when forming the polarizer 104, the sub-layers inthe polarizer 104 (e.g., the sub-polarizing films 1044A, 1044B, and1044C in FIG. C) are stretched to have absorption axes extending along aspecific direction. However, when the sub-layers of the polarizer 104are stretched, the sub-layers are shrunk along a direction perpendicularto the stretching direction, resulting in misalignment between thesub-layers of the polarizer 104. As shown in FIG. 1C, if an anglebetween the extending direction of the conductive adhesive 106 and theabsorption-axis direction of the polarizer 104 is about 80 degrees andabout 100 degrees, the sub-polarizing films 1044A, 1044B, and 1044C ofthe polarizer 104 may not have retracted edges in the extendingdirection of the conductive adhesive 106 (e.g., the X-axis in FIG. 1C).Therefore, the penetration of the conductive adhesive 106 into thepolarizer 104 may be reduced, thereby affecting the display effect ofthe electronic device 10.

Referring to FIG. 2 . FIG. 2 is a top view of an electronic device 20according to other embodiments of the present disclosure. The electronicdevice 20 of FIG. 2 is similar to the electronic device 10 of FIG. 1A,except that the conductive adhesive 106 of the electronic device 20extends along a different direction than the conductive adhesive 106 inthe electronic device 10. Specifically, as shown in FIG. 2 , theconductive adhesive 106 may be adjacent to the edge of the polarizer 104and extend longitudinally along the Y-axis. In an embodiment, a portionof the conductive adhesive 106 extending along the edge of the polarizer104 may be in contact with the edge of the polarizer 104.

Furthermore, an angle between the extending direction of the conductiveadhesive 106 in the electronic device 20 and the absorption-axisdirection of the polarizer 104 may be between about 80 degrees and about100 degrees, such as about 90 degrees. Likewise, the angle between theextension direction of the conductive adhesive 106 and theabsorption-axis direction of the polarizer 104 in the above range mayreduce the penetration of the conductive adhesive 106 into the polarizer104, thereby affecting the visual effect of the peripheral area of theelectronic device 20. Furthermore, the above design is also conducive tothe development of the electronic device 20 toward extremely narrowborders.

In the embodiment shown in FIG. 2 , the length of the interface wherethe conductive adhesive 106 is in contact with the polarizer 104 alongthe extending direction of the conductive adhesive 106 (e.g., the Y-axisin FIG. 2 ) may be greater than about 10% of the length of the polarizer104 along the extension direction of the conductive adhesive 106, suchas greater than about 20%, about 30%, about 40%, about 50%, about 60%,about 70%, about 80%, or about 90%. If the length of the interface wherethe conductive adhesive 106 is in contact with the polarizer 104 alongthe extending direction of the conductive adhesive 106 (e.g., the Y-axisin FIG. 2 ) is too short, such as less than about 10% of the length ofthe polarizer 104 along the extension direction of the conductiveadhesive 106, the conductive adhesive 106 may not effectively conductthe static electricity accumulated on the surface of the electronicdevice 20. Furthermore, in some embodiments, the length of the interfacewhere the conductive adhesive 106 is in contact with the conductivelayer 1042 along the extending direction of the conductive adhesive 106(e.g., the Y-axis in FIG. 2 ) may be equal to the length of thepolarizer 104 along the extension direction of conductive adhesive 106.

As mentioned above, according to some embodiments of the presentdisclosure, the electronic device includes a polarizer and a conductiveadhesive disposed on a first substrate. The conductive adhesive isadjacent to an edge of the polarizer, and an angle between an extensiondirection of the conductive adhesive and an absorption-axis direction ofthe polarizer is between 80° and 100°. As such, the possibility of theconductive adhesive being penetrated into the polarizer in a humid andwarm environment may be reduced, which may otherwise negatively affectthe visual effect of the peripheral area of the electronic device.

Although some embodiments of the present disclosure and their advantageshave been disclosed above, it should be understood that a person ofordinary skill in the art may change, replace and/or modify the presentdisclosure without departing from the spirit and scope of the presentdisclosure. The features between the embodiments of the presentdisclosure may be arbitrarily combined as long as they do not violate orconflict with the spirit of the present disclosure. In addition, thescope of the present disclosure is not limited thereto the process,machine, manufacturing, material composition, device, method, and stepin the specific embodiments described in the specification. A person ofordinary skill in the art will understand current and future process,machine, manufacturing, material composition, device, method, and stepfrom the content disclosed in the present disclosure, as long as thecurrent or future process, machine, manufacturing, material composition,device, method, and step performs substantially the same functions orobtain substantially the same results as the present disclosure.Therefore, the scope of the present disclosure includes theabove-mentioned process, machine, manufacturing, material composition,device, method, and steps. The scope of the present disclosure should bedetermined by the scope of the claims. It is not necessary for anyembodiment or claim of the present disclosure to achieve all of theobjects, advantages, and/or features disclosed herein.

What is claimed is:
 1. An electronic device, comprising: a firstsubstrate; a polarizer disposed on the first substrate and having aconductive layer; and a conductive adhesive disposed on the firstsubstrate and electrically connected to the conductive layer, whereinfrom a top view, the conductive adhesive is adjacent to an edge of thepolarizer and has an extending direction, and an angle between theextending direction and an absorption-axis direction of the polarizer isbetween 80° and 100°.
 2. The electronic device as claimed in claim 1,wherein the conductive adhesive is in contact with the edge of thepolarizer.
 3. The electronic device as claimed in claim 2, wherein theconductive adhesive and the polarizer have a contact region, a portionthe contact region is a region where the conductive adhesive is incontact with the conductive layer, and a length of the portion of thecontact region along the extending direction is greater than 10% of awidth of the polarizer along the extending direction from the top view.4. The electronic device as claimed in claim 3, wherein a width of thecontact region in a normal direction of the first substrate is greaterthan a thickness of the conductive layer in the normal direction of thefirst substrate.
 5. The electronic device as claimed in claim 4, whereinthe width of the contact region in the normal direction of the firstsubstrate is between 1 μm and 250 μm.
 6. The electronic device asclaimed in claim 1, wherein a topmost surface of the conductive adhesiveis lower than an upper surface of the polarizer.
 7. The electronicdevice as claimed in claim 1, further comprising a second substratedisposed between the polarizer and the first substrate, wherein theconductive adhesive has a thickness from an upper surface of the secondsubstrate to a topmost surface of the conductive adhesive, and thethickness is smaller than a thickness of the polarizer.
 8. Theelectronic device as claimed in claim 7, wherein the thickness of theconductive adhesive is between 1 μm and 250 μm.
 9. The electronic deviceas claimed in claim 7, further comprising a conductive pad disposed on aportion of the first substrate that does not overlap with the secondsubstrate.
 10. The electronic device as claimed in claim 9, wherein theconductive adhesive is formed on the conductive pad and extend from theconductive pad to the first substrate and the second substrate.
 11. Theelectronic device as claimed in claim 7, further comprising a liquidcrystal layer sandwiched between the first substrate and the secondsubstrate.
 12. The electronic device as claimed in claim 11, whereinprojection planes of the liquid crystal layer and the second substrateon the first substrate overlap each other.
 13. The electronic device asclaimed in claim 11, further comprising an additional polarizer disposedon the side of the first substrate not disposed with the liquid crystallayer.
 14. The electronic device as claimed in claim 7, wherein thesecond substrate comprises a base substrate and an alignment layerdisposed on a side of the base substrate not disposed with thepolarizer.
 15. The electronic device as claimed in claim 1, wherein thefirst substrate comprises: a base substrate; a thin film transistorlayer disposed on the base substrate and used as a driving circuit; anelectrode layer disposed on the base substrate and electricallyconnected to the thin film transistor layer; and an alignment layerdisposed on the thin film transistor layer and the electrode layer. 16.The electronic device as claimed in claim 1, wherein the polarizerfurther comprises a polarizing film, and the conductive adhesive is atleast in contact with the conductive layer of the polarizer.
 17. Theelectronic device as claimed in claim 16, wherein the conductiveadhesive is in contact with both the conductive layer and the polarizingfilm of the polarizer.
 18. The electronic device as claimed in claim 1,wherein a resistance of the conductive layer is between 10⁸Ω/ and10¹⁰Ω/.
 19. The electronic device as claimed in claim 1, wherein athickness of the conductive layer is between 1 μm and 30 μm.
 20. Theelectronic device as claimed in claim 1, wherein a thickness of thepolarizer is between 50 μm and 250 μm.